T.D. Pope, C. Chevalier, C. Alain, A. Bergeron, H. Jerominek, L. N. Phong, W. Zheng, I. Zayer, J.-L. Bézy "512X3 pixel uncooled FPA for thermal infrared pushbroom imaging" IAC - 55th International Astronautical Congress, pp. 973-981, 2004
Abstract: There are an increasing number of planned earth and planetary observation missions incorporating thermal infrared imaging instruments. The integration of uncooled microbolometer technology into these instruments provides size, mass, and power consumption advantages that are beneficial for small satellite missions and crucial to micro and nano-satellite missions. INO and CSA have developed a unique and versatile Canadian microbolometer technology for satellite missions. This technology has recently been applied to the development of an uncooled focal plane array designed to meet the specific needs of satellite-based thermal infrared imaging. The array consists of three parallel rows of 512 pixels on a 39 µm pitch. Each pixel includes active and reference detectors for on-chip pixel offset correction and increased immunity to die temperature drift. The readout electronics integrates each pixel in parallel, cancels its own offset and low frequency noise and provides 14-bit digital output. A compact circuit card assembly for operating and collecting data with the 512x3 pixel FPA has been designed and fabricated. It fits in an envelope 75mm x 75mm x 50mm and has a power consumption of 3.75 W.
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