Post-processing of silicon photonics wafers

INO offers silicon photonics packaging and wafer post-processing services. We have the ability to deliver silicon photonics devices showing very low insertion losses and submicronic optical alignment repeatability.

Post-processing of silicon photonics wafers

INO offers post-processing services of 150 mm and 200 mm (6’’ and 8’’) silicon substrates. Our custom services include design, lithography, metal and dielectric deposition and patterning, and dicing.

Our specialty: Wafer post-processing and probing

Lithography Ino

  • Lithography ≥ 400 nm critical dimensions, 100 nm overlay
  • Metal deposition: solderable layer, rerouting
  • Dielectrics deposition (SiO2, SiOxNy, Si3N4): Refractive index between 1.45 and 2.3, meaning a broad range and perfect control of your specifications
  • Passive alignment structures
  • Wafer probing: electrical probing (DC) and optical probing combination to test and characterize your design.

Fields of application

  • Telecommunications
  • Data centers
  • Biomedical


We also offer silicon photonics packaging services. Please contact us now for more information!

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What are your needs?

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