INO offers silicon photonics packaging and wafer post-processing services. We have the ability to deliver silicon photonics devices showing very low insertion losses and submicronic optical alignment repeatability.
INO offers post-processing services of 150 mm and 200 mm (6’’ and 8’’) silicon substrates. Our custom services include design, lithography, metal and dielectric deposition and patterning, and dicing.
We also offer silicon photonics packaging services. Please contact us now for more information!