INO offers silicon photonics packaging and wafer post-processing services. We have the ability to deliver silicon photonics devices showing very low insertion losses and submicronic optical alignment repeatability.
Packaging accounts for a gigantic part of silicon photonics devices’ overall cost. Thanks to more than 20 years of experience in multiple packaging applications, INO can assume this critical challenge. We build custom silicon photonics packages that will meet your specifications.
The combination of our multidisciplinary team’s expertise, of our coupling methods and of our state-of-the-art equipment (featuring a < 100 nm and < 0.005° alignment repeatability) enables us to perform edge and vertical coupling while minimizing losses due to fixation process.
Edge coupling performances:
Vertical coupling performances:
Our team will work closely with you to develop your specific package.
We also offer package headers that can be customized on request, reducing the cost of development. Main specifications are:
For RF photonics applications:
INO has the ability to build custom prototypes that will meet your needs, and also produce your device in short series. From design to short-run production, INO’s integrated offer has it all.
As our specialty is customization and short series production, this technology is available for transfer in case you are seeking large volumes.
INO acquired a state-of-the art, submicronic assembly station, boosting our packaging and alignment capacities.
We also offer post-processing of silicon photonics wafers services. Please contact us now for more information!