Silicon Photonics Packaging

INO offers silicon photonics packaging and wafer post-processing services. We have the ability to deliver silicon photonics devices showing very low insertion losses and submicronic optical alignment repeatability.

Silicon photonics packaging

Packaging accounts for a gigantic part of silicon photonics devices’ overall cost. Thanks to more than 20 years of experience in multiple packaging applications, INO can assume this critical challenge. We build custom silicon photonics packages that will meet your specifications.

Our specialty: Custom silicon photonics packages

Silicon Photonics Packaging Ino

The combination of our multidisciplinary team’s expertise, of our coupling methods and of our state-of-the-art equipment (featuring a < 100 nm and < 0.005° alignment repeatability) enables us to perform edge and vertical coupling while minimizing losses due to fixation process.

Edge coupling performances:

  • Losses due to fixation process < 1.5 dB per fiber @ 1571 nm for a MFD @ 2500 nm
  • Alignment tolerance < 1 µm

Vertical coupling performances:

  • Losses due to fixation process < 0.5 dB

Our team will work closely with you to develop your specific package.

Package headers

We also offer package headers that can be customized on request, reducing the cost of development. Main specifications are:

  • O/D 47.9 x 43.4 x 9 mm3
  • I/D 34 x 41.4 x 7.25 mm3
  • 40 electrical i/o
  • 6 optical i/o
  • Laser welded ferrules
  • TEC, thermistor

Silicon Photonics Package Ino


For RF photonics applications:

  • O/D 35.5 x 62 x 15 mm3
  • I/D 24 x 48 x 8.15 mm3
  • 18 GPPO i/o < 3dB
  • 5 DC i/o
  • 12 optical i/o
  • 15 GHz

RF Package

Our strength : Prototyping and short-run production

INO has the ability to build custom prototypes that will meet your needs, and also produce your device in short series. From design to short-run production, INO’s integrated offer has it all.

As our specialty is customization and short series production, this technology is available for transfer in case you are seeking large volumes.

Fields of application:

  • Telecommunications
  • Data centers
  • Biomedical


INO acquired a state-of-the art, submicronic assembly station, boosting our packaging and alignment capacities.

  • 13 axis
  • Repeatability < 100 nm, < 0.005°
  • Glue dispensing and UV curing
  • Laser welding
  • Optical probing ≤ 200 mm wafers
  • VIS + IR cameras
  • TEC controller
  • LabVIEW-based software
  • Automated processes


We also offer post-processing of silicon photonics wafers services. Please contact us now for more information!

You have a project in mind? Talk with our specialists.

You have a project in mind? Talk with our specialists.

Contact us


You will receive a confirmation email including your request, for your track record.