Packaging often accounts for the bulk of MEMS/MOEMS costs, particularly when a specific atmosphere is required. All packaging parameters, including lateral dimensions, volume, mass, mechanical strength, electrical, thermal and optical properties have an impact either on the properties of the devices or the properties and operation of any instruments that incorporate these detectors. It is therefore critical to develop and optimize packages to yield maximal performance.
Although overall performance is a key criterion, cost and weight can be equally important packaging criteria. INO combines more than 25 years of experience in MEMS packaging, including:
In order to meet specific MEMS/MOEMS packaging requirements, INO has developed a variety of packaging techniques used for its own uncooled bolometric detectors and other MEMS devices. Metal or ceramic headers can be used in INO’s packaging techniques.
Thanks to our inventory of leading edge equipment, we are able to package a wide range of MEMS devices. We select the package best suited to your application and requirements. We can adapt it to accommodate required parameters, such as chip size, electrical connections, operation temperature, lid type, etc., to match your specifications and deliver maximum performance.
We also offer a MEMS-Pirani pressure microsensor for pressure monitoring. This device can be sold separately and can also include a user-friendly control unit for direct pressure measurement.
Ceramic and metallic hermetic vacuum packaging techniques are available for technology transfer. These technologies are perfect for the packaging of bolometers or other MEMS devices that require a vacuum environment down to 1 mTorr.
Choosing a technology transfer with INO is the best way to gain a unique competitive advantage over your competitors. It means benefiting from knowledge acquired over 25 years, using proven technology to build high quality products and bring them to market faster.