MEMS Packaging Services

We offer custom packaging services for MEMS/MOEMS devices. We have developed a variety of hermetic vacuum packaging technologies to optimize the performance of your MEMS according to your needs.

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In addition to ceramic and metallic packages specially designed for uncooled bolometric detectors and high-end military and space applications, we can put together a custom package to your specifications. INO specializes in three main packaging technologies:

  • Pinching of pump-out tube with thermoelectric cooler (TEC)
  • Solder sealing (1-step)
  • Solder sealing (2-step) with TEC

Packaging operations are performed using state-of-the-art vacuum furnaces and systems that allow for the activation of various types of getters. Depending on the technology used, vacuum levels can now be maintained at < 10 mTorr for up to 25 years. 

We offer a full range of services for all your MEMS needs: