MEMS and Microbolometers Packaging Services

Ceramic LCC packages (517 ko) Metallic packages with HTCC inserts (444 ko) Thermally Stabilized Ceramic Packages (642 ko) MEMS-Pirani Pressure Microsensor and Control Software (852 ko) MEMS Pirani Pressure Microsensor with Improved Reading Unit (640 ko)

INO offers custom packaging services for MEMS/MOEMS devices based on ceramic and metallic headers. We have developed a variety of hermetic vacuum packaging technologies in order to offer you the right solution for maximizing the performance of your MEMS based on your needs.

Our expertise: Custom MEMS hermetic packaging

In addition to providing ceramic and metallic packages designed for uncooled bolometric detectors and high-end military and space applications, INO can design a custom package to match your requirements. INO specializes in four main packaging technologies:

Pump-out tube w/ TEC
Solder sealing (1-step)
Solder sealing (2-step) w/ TEC

Processes are performed in state-of-the-art vacuum furnaces and systems that allow for activation of various getters. Depending on the selected technology, vacuum levels can be maintained at <10mTorr for up to 25 years.

Our strength: Integrated services for MEMS development

INO offers a full range of services for all your MEMS needs:

Whether you are looking for a specific service or a fully integrated MEMS design, INO is the right partner for you. Please contact us for more information!