Most of the time, the lids/windows that come with MEMS packages are barebones. To hermetically assemble the lid to the MEMS package, and get the maximum performance out of a MEMS, hermetic solder layers are necessary.
INO offers hermetic solder layer deposition services for MEMS. Our highly flexible metallization capabilities for hermetic packaging allow us to meet specific requirements. We can deposit metallic thin films on various materials, such as glass, ceramic, silicon, germanium, sapphire, quartz, diamond, and metals.
Nominal specifications of solderable layer deposition:
Please contact us for more information.