We offer hermetic solder layer deposition services for hermetic packaging. Our highly flexible process allows us to meet your specific requirements. We can deposit metallic thin films of gold, nickel, chrome, or titanium on various materials such as glass, ceramic, silicon, germanium, sapphire, quartz, diamond, and metals. Samples can be supplied individually or in chip wafers up to 200 mm in diameter, which can then be cut to the desired dimensions.
We offer customized metallization capabilities for package lids and windows for vacuum seal packaging:
Nominal specifications of solderable layer deposition: